Skill

slice crystals into wafers

Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.

Alternative Names

operate wire saw machineswire saw machine operatingcrystal slicing to make wafersoperating wire saw machineswire saw machines operatingslicing crystals into wafers

Essential for these occupations

slice crystals into wafers is listed as an essential skill for 1 occupation(s).

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Quick Facts

TypeSkill
ClassificationESCO
DigitalNo
GreenNo
Essential for1 occupations
Total occupations1
Alt names6

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